2010年5月6日星期四

TSMC beyond the direct development of Intel 20-nanometer process

Sina Technology News on April 15 morning news, according to Taiwan media reports, the development of TSMC's senior vice president of research, said Jiang Shangyi, TSMC will skip 22 nm process, direct the development of 20 nanometer manufacturing process, section 2012 three quarters of introduction, in 2013 a large number of mass production, the progress for the first time beyond the semiconductor leader Intel, TSMC's advanced process in the development of the world's first win.

Jiang Shangyi time in 13 Spanish-American American Technology Forum 2010, TSMC reveal new targets. Intel's first quarter earnings beat expectations, driving the performance of the domestic semiconductor groups rose, TSMC is also due to launch 20 nm leading to drive shares rose NT 0.9 yuan to 63.8 yuan to close at NT, the highest stage of a new high.

processor maker Intel has always been a leader in the semiconductor manufacturing process, Intel's 32 nanometer process last year, mass production, by the end of 2011 will introduce 22 nm process products, TSMC will skip 22 nm, stepping into 20 nm, challenge Intel's leadership in advanced process status.

TSMC is expected this year to 4.8 billion U.S. dollars of capital spending, continues to dominate the foundry industry, and an effective capacity of the leading providers. Part in the advanced manufacturing process, announced yesterday that 22 nm skip directly to the development of 20 nm, TSMC said it was based on creating value for customers and make decisions.

Jiang Shangyi technology forum in the "innovative new way" (A new way to innovation) as the title speech, he referred to TSMC next three things need to do first, advanced process technology continues forward is to provide super-Moore's Law (Moore's than More) possibility of development for the semiconductor manufacturing process to find a new extension is to continue to integrate the three packages, 3DIC, silicon intellectual material.

Jiang Shangyi and announced that TSMC will be directly put into 20-nm development; He said that 20-nanometer process than the 22 nm has a superior chip gate density and performance / cost ratio, the higher gate density than the two 28 nm times.

Taiwan Semiconductor Manufacturing Company in May 2008 with Intel, Samsung Electronics has been a joint statement in 2012 will be the development of semiconductors in 18? Fab the right time, then TSMC and Intel, Samsung and other semiconductor manufacturers will become the latest generation of leadership with the plant.

the outside world is concerned about the TSMC 20 nm at 18? Fab, TSMC said it depends on the status of the industry; equipment manufacturers that once the 20-nanometer production starts, demand for 18 inch will have the opportunity to emerge, triggering the next generation equipment manufacturers business opportunities. (LUO)

> Related: TSMC January-March revenue of NT 30.8 billion Taiwan Semiconductor Manufacturing Company has no intention to end the factory moved to mainland China have submitted documents to apply for shares of TSMC SMIC 10 %

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